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            當前位置:主頁 > 產品中心 > 主控芯片

            RK3399

            RK3399 is a low power, high performance processor for computing, personal mobile internet devices and other smart device applications.
            型號:RK3399
            品牌:ROCKCHIP
            封裝:FCBGA828
            批號:17+
            庫存:600

            規格書(Datesheet):RK3399.PDF 點擊下載

            商品信息

             

                  RK3399 is a low power, high performance processor for computing, personal mobile internet  devices and other smart device applications. Based on Big.Little architecture, it integrates dual-core Cortex-A72and quad-core Cortex-A53 with separate NEON coprocessor.(點擊即可咨詢芯片詳細信息
             
            RK3399’s Features
            1、 Microprocessor
            l - Dual-core ARM Cortex-A72 MPCore processor and Quad-core ARM Cortex-A53 MPCore
            processor, both are high-performance, low-power and cached application processor
            l - Two CPU clusters. Big cluster with dual-core Cortex-A72 is optimized for high-performance and little cluster with quad-core Cortex-A53 is optimized for low power.
            l - Full implementation of the ARM architecture v8-A instruction set, ARM Neon Advanced
            SIMD (single instruction, multiple data) support for accelerating media and signal processing
            l - ARMv8 Cryptography Extensions.
            l - SCU ensures memory coherency between the MPCore for each cluster.
            l - TCCI500 ensures the memory coherency between the two clusters
            - Each Cortex-A72 integrates 48KB L1 instruction cache and 32KB L1 data cache with 4-way set associative. Each Cortex A53 integrates 32KB L1 instruction cache and 32kB L1 data cache separately with 4-way set associative
            l - 1MB unified L2 Cache for Big cluster, 512KB unified L2 Cache for Little cluster.
            l - Trustzone technology support
            - Full Coresight debug solution
            l - Eight separate power domains for CPU core system to support internal power switch and externally turn on/off based on different application scenario
             
            2、Memory Organization
            l - Internal on-chip memory
            l - External off-chip memory
            3、 Internal Memory
            l - Internal BootRom
            l - Internal SRAM
            4、External Memory or Storage device
            l - Dynamic Memory Interface (DDR3/DDR3L/LPDDR2/LPDDR3)
            from various vendor
            l - eMMC Interface
            l - SD/MMC Interface
            5、System Component
            l - Cortex-M0
            - CRU (clock & reset unit)
            l - PMU
            l - Timer
            - PWM
            l - WatchDog
            - MailBox
            l - Bus Architecture
            l - Interrupt Controller
            l - DMAC
            l - Security system
            6、Video CODEC
            l - Embedded memory management unit(MMU)
            l - Video Decoder
            l - Video Encoder
            7、 JPEG CODEC
            l - JPEG decoder
            8、Image Enhancement (IEP module)
            l - Image pre-processor
            l - Video stabilization
            l - Image Post-Processor(embedded inside video decoder)
            - Image Enhancement-Processor (IEP)
            9、 Graphics Engine
            -3D Graphics Engine
            -2D Graphics Enginel-
            10、 Video IN/OUT
            l - Camera Interface
            - Image Signal Processer
            - Display Interface
            - Video Output Processor(VOP_BIG)
            - Write back
            - Embedded memory management unit(MMU)
            11、 HDMI
            - Single Physical Layer PHY with support for HDMI 1.4 and 2.0 operation
            - Link controller flexible interface with 30-, 60- or 120-bit SDR data access
            - Support HDCP 1.4/2.2
            12、MIPI PHY
            -Embedded 3 MIPI PHY, MIPI0 only for DSI, MIPI1 for DSI or CSI, MIPI2 only for CSI
            -Lane operation ranging from 80 Mbps to 1.5 Gbps in forward direction
            -Each port have 4 data lane, providing up to 6.0 Gbps data rate
            -Support 1080p@60fps output with single channel
            -Support 2560x1600@60fps output with MIPI0 and MIPI1 dual channel
            13、eDP PHY
            -Compliant with eDPTM Specification, version 1.3
            -Support RGB 6/8/10bit video format
            -Up to 4 physical lanes of 2.7/1.62 Gbps/lane
            -Support VESA DMT and CVT timing standards
            -Fully support EIA/CEA-861Dvideo timing and Info Frame structure
            -Hot plug and unplug detection and link status monitor
            -Supports Panel Self Refresh(PSR)
            14、DisplayPort
            -Compliant with DisplayPort Specification, version 1.2
            -Compliant with HDCP2.2 (and back compatible with HDCP1.3)
            -There is only one DisplayPort controller built-in RK3399 which is shared by 2 Type-C
            interface
            -25-600Mhz pixel clock
            -Supports 8/10 bpp RGB,YCbCr422,YCbCr420formats
            -Supports up to 4kx2k at 60Hz resolution
            -Variety of audio formatsPCM and compressed, over I2S or SPDIF interfaces
            -1Mbps AUX channel
            15、TYPE-C Interface
            - Embedded 2 Type-C PHY
            - Compliant with USB Type-C Specification, revision 1.1
            - Compliant with USB Power Delivery Specification, revision 2.0
            - Attach/detach detection and signaling as DFP, UFP and DRP
            - Plug orientation/cable twist detection
            - Enable/disable VBUS as DFP and DRP(when operating as DFP)
            - VBUS detection as UFP and DRP(when operating as UFP)
            - USB Power Delivery communication across the CC wire
            - Support USB3.0 Type-C and DisplayPort 1.2 Alt Mode on USB Type-C. Two PMA TX-only
            lanes and two PMA half-duplex TX/RX lanes(can be configured as TX-only or RX-only)
            - Up to 5Gbps data rate for USB3.0
            - Up to 5.4Gbps(HBR2) data rate for DP1.2, can support 1/2/4 lane mode
            - Support DisplayPort AUX channel
             
            16、 Audio Interface
            l - I2S0/I2S1 with 8ch
            l - I2S2/PCM with 2ch
            l - SPDIF
            17、 Connectivity
            l - SDIO interface
            l - GMAC 10/100/1000M Ethernet Controller
            l - SPI Controller
            l - UART Controller
            l - I2C controller
            l - GPIO
            l - USB OTG3.0
            18、USB 2.0 Host
            19、PCIe
            20、 Others
            l - Temperature Sensor(TS-ADC)
            -SAR-ADC(Successive Approximation Register)
            l - eFuse
            l - Package Type
            n BGA316 (body: 14mm x 14mm ; ball size : 0.3mm ; ball pitch : 0.65mm)
             
            RK3399’s Block Diagram
            RK3399's Block Diagram  
            RK3399’s Package
            RK3399's Package
            RK3399's Package
            RK3399’s Ordering Information

            RK3399's Ordering Information

            RK3399's Ordering Information

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